The CC-Link Partner Association (CLPA) will exhibit once more at SPS IPC Drives Italia (Hall 6, Stand F012) from 28th-30th May, 2019. During the event CC-Link IE TSN, the latest open Ethernet technology developed by the CLPA, will be presented to the Italian market for the first time.
The CLPA is committed to supporting the interests of the Italian automation market, which continues to make its importance to global industry felt. Evidence of this can be seen in the corresponding increase in the importance of the fair itself which has shown steady growth over the last eight years.
In 2019, the exhibition will present the leading trends in automation and digitalisation. . In line with the key topics of the ninth edition of SPS Italia, the CLPA’s booth will demonstrate how CC-Link IE TSN can support Italian industrial automation vendors, machine builders and end users.
The CLPA’s next-generation open Ethernet technology, CC-Link IE TSN, is built over three pillars: Performance, Connectivity and Intelligence. These features make it ideal for Industry 4.0 applications of today and the future. Therefore, manufacturers can reap the benefits of advanced open industrial communications and Big Data insights.
CC-Link IE TSN offers the ideal solution to bridge information technology (IT) and operational technology (OT) systems whilst ensuring peak performance and reliability. More precisely, this latest member of the CC-Link family handles both time critical process traffic along with less sensitive data on the same network, helping to simplify systems, lower costs and increase productivity. These capabilities are achieved by combining Gigabit bandwidth, first introduced with CC-Link IE, and Time Sensitive Networking (TSN), as defined by the IEEE 802.1 standards.
In addition, CC-Link IE TSN optimises ease of use and interconnectivity. This is assisted by the CLPA’s CSP+ (Control & Communication System Profile) technology, which makes it easier to start up, operate and ensure compatibility among devices and, in fact, entire machines from different vendors via CSP+ for Machine. CSP+ for Machine also supports OPC UA, hence providing connectivity via this increasingly important communication method.
Visitors to the stand will be able to see how CC-Link IE TSN is being implemented now via the first fully operational products from Hirschmann and Mitsubishi Electric.
The CLPA’s stand will also offer an overview of the comprehensive range of development options being planned for CC-Link IE TSN. The extensive offering is intended to remove all barriers to product development and offer a variety of industry standard solutions that will make it easy for all vendors to incorporate the technology into their products, regardless of existing designs.
John Browett, General Manager of CLPA Europe, comments: “We are delighted to once again be part of the upcoming SPS IPC Drives Italia. Italy is a particularly important region for the CLPA and we have longstanding relationships with device vendors here. Therefore, we are confident that CC-Link IE TSN will generate a lot of interest in the Italian market. We invite anyone interested in learning more about how the technology can improve their own manufacturing operations to visit us in Hall 6, Stand F012. CLPA’s experts will be able to answer your questions and provide guidance.”